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Books by John H Lau

Heterogeneous Integrations by John H Lau Heterogeneous Integrations
John H Lau
Paperback , Jun '19
Advanced Mems Packaging by John H Lau Advanced Mems Packaging
John H Lau
Digital (delivered electronically) , Jan '09
Advanced Mems Packaging by John H Lau Advanced Mems Packaging
John H Lau
Digital (delivered electronically) , Oct '09
Heterogeneous Integrations by John H. Lau Heterogeneous Integrations
John H. Lau
Hardback , Jul '19
Handbook Of Tape Automated Bonding by John H. Lau Handbook Of Tape Automated Bonding
John H. Lau
Hardback , Jan '92
Thermal Stress and Strain in Microelectronics Packaging by John H. Lau Thermal Stress and Strain...
John H. Lau
Hardback , Aug '93
Electronic Packaging: Design, Materials, Process, and Reliability by John H. Lau Electronic Packaging: Design,...
John H. Lau
Hardback , Feb '98
CHIP SCALE PACKAGE, CSP by John H. Lau CHIP SCALE PACKAGE, CSP
John H. Lau
Hardback , Feb '99
Assembly and Reliability of Lead-Free Solder Joints by John H. Lau Assembly and Reliability...
John H. Lau
Paperback , Jun '21
Microvias: For Low Cost, High Density Interconnects by John H Lau Microvias: For Low Cost,...
John H Lau
Digital (delivered electronically) , Jan '01
Solder Joint Reliability by John H. Lau Solder Joint Reliability
John H. Lau
Paperback , Feb '14
Reliability of Rohs-Compliant 2D and 3D IC Interconnects by John H Lau Reliability of Rohs-Compliant...
John H Lau
Digital (delivered electronically) , Jan '10
The Handbook of Fine Pitch Surface Mount Technology by John H. Lau The Handbook of Fine Pitch...
John H. Lau
Hardback , Oct '93
Fan-Out Wafer-Level Packaging by John H. Lau Fan-Out Wafer-Level Packaging
John H. Lau
Hardback , Aug '18
Semiconductor Advanced Packaging by John H. Lau Semiconductor Advanced Packaging
John H. Lau
Hardback , Aug '21
Chiplet Design and Heterogeneous Integration Packaging by John H. Lau Chiplet Design and Heterogeneous...
John H. Lau
Paperback , Apr '24
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies by John H. Lau Low Cost Flip Chip Technologies...
John H. Lau
Hardback , Feb '00
Solder Joint Reliability by John H. Lau Solder Joint Reliability
John H. Lau
Hardback , May '91
Chip On Board by John H. Lau Chip On Board
John H. Lau
Hardback , Jun '94
Semiconductor Advanced Packaging by John H. Lau Semiconductor Advanced Packaging
John H. Lau
Paperback , Jun '22
Chiplet Design and Heterogeneous Integration Packaging by John H. Lau Chiplet Design and Heterogeneous...
John H. Lau
Hardback , Jun '23
Assembly and Reliability of Lead-Free Solder Joints by John H. Lau Assembly and Reliability...
John H. Lau
Hardback , Jul '20
Fan-Out Wafer-Level Packaging by John H. Lau Fan-Out Wafer-Level Packaging
John H. Lau
Paperback , Dec '18
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by John H. Lau Flip Chip, Hybrid Bonding,...
John H. Lau
Hardback , Sep '24
Reliability of Rohs-Compliant 2D and 3D IC Interconnects by Dr John H Lau Reliability of Rohs-Compliant...
Dr John H Lau
Digital (delivered electronically) , Oct '10
3D IC Integration and Packaging by Dr John H Lau 3D IC Integration and Packaging
Dr John H Lau
Digital (delivered electronically) , Jul '15
Microvias: For Low Cost, High Density Interconnects by Dr John H Lau Microvias: For Low Cost,...
Dr John H Lau
Digital (delivered electronically) , May '01
Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by Dr John H Lau Electronics Manufacturing:...
Dr John H Lau
Digital (delivered electronically) , Sep '02
Through-Silicon Vias for 3D Integration by Dr John H Lau Through-Silicon Vias for 3D Integration
Dr John H Lau
Digital (delivered electronically) , Aug '12
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